2009 will bring us among other things the new generation of iMacs. We’re actually waiting for them early next year. One of their new features might be the new cooling system according to various sources outside the Taiwanese manufacturing facilities.

Foxconn is now said to be responsible with building the new iMacs. The company will be making the new magnesium-aluminum alloy chassis. And the same company will be responsible for the cooling system.

Other rumors are saying that Apple, HP, Acer and Dell have agreed, despite rivalries, to each use the new quad-core desktop chips provided by Intel. Desktops arriving in early 2009 should receive the new chips.

The chips are the Core 2 Quad Q8200 (2.33GHz/4MB L2), Core 2 Quad Q9400 (2.66GHz/6MB L2), and Core 2 Quad Q9550 (2.83GHz/12MB L2). The chips will be operating at 65W which is 10W higher than the usual 55W iMacs chips. That’s why Apple should ask for a new cooling system to cope with the extra power.

Apple has orders for 800,000 new iMacs per quarter starting with mid-January. What else are we going to expect?

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