NEC's New Corn-Based Bioplastic: Coming Soon to a Phone Near You
The Japanese company NEC has developed a new form of plastic. Their bioplastic solution makes use of fermented corn and kenaf fiber. Use of this plastic has already begun as of March last year. Benefits from the use of the plastic would include a lighter, and cooler running device. For example, the corn-based bioplastic product conducts heat faster than stainless steel and would delete the extra weight from stainless steel heat releasing shields. Although the new plastic is cheaper than other fiber-reinforced plastics, it still remains more expensive than stainless steel. NEC aims to bring the bioplastic as a source material for mobile phones and laptops beginning in April 2008. Additionally, NEC hopes to replace most current plastics with the bioplastic by 2010.